Tungsten slurry is composed of tungsten powder, inorganic binder phase and organic carrier, which has extremely high melting point, good conductivity and thermal conductivity. It is widely used in high temperature co-firing technology.
Tungsten powder provides the premise for good sealing. The role of inorganic binder phase is to help sinter and provide sealing strength. The organic carrier is divided into three parts: resin, solvent and additive. Surfactant, leveling agent, antifoaming agents and other organic additives.
Applications
Melting point of tungsten slurry is high, which can reach 3410℃. It has good electrical conductivity, thermal conductivity, suitable for common alumina substrate. It can also be a good match with good prospects for the future of aluminum nitride substrate. It has been widely used in high temperature co-firing technology.
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