Tungsten copper board file is a file fitter filing of tool steel, steel file sub-flat, round, square, angular, five and a half, flat to flat file also challenge the filing, circle is round file, square is square file, triangular file angle, half semicircle filing, the board filing can also be called flat file.
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Tungsten copper file is after pressing by the mixed powder, liquid phase sintering at 1300-1500 °. Method of Preparation This material is uniformly bad, there are more closed the gap, the density is usually less than 98%, but by adding a small amount of nickel activated sintering, mechanical alloying or oxide reduction method for ultra-fine, nano powder sintering activity can be improved, thereby improving the tungsten copper, molybdenum copper alloy density.