Tungsten copper support plate means it is used as a key foundation dedicated integrated circuit card module encapsulation material, primarily protects the chip and the role of integrated circuit chips and external interface as in the form of the strip, the surface will be gold-plated gold yellow.
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Tungsten copper support plate having both low expansion characteristics of tungsten, and high thermal conductivity properties have copper, especially valuable is that its thermal expansion coefficient and thermal conductivity can be designed by the adjustment of composition material and thus to the application of the material brought a great convenience.