
In wafer testing, various types of tungsten probes are used to make electrical contact with semiconductor devices on the wafer. The choice of probe type depends on the specific requirements of the testing process. Here are some common types: Wire Bonding Probes: Description: These probes are used for wire bonding applications, where wires are bonded to semiconductor devices for interconnection. Application: Wire bonding is a common technique in semiconductor packaging, and tungsten wire bonding probes are used to make electrical…